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High Value Passive Component Integration in LTCC
Keywords: LTCC, MCM, Passive Components
Demand for increasing functionality in automotive electronics coupled with decreasing available real estate is driving the need for ultra high density electronic packaging. To meet this demand, the IDEAS Packaging Lab at Purdue University is developing novel high value, high-Q passive components buried in LTCC substrates. The passive components enable low RF frequency system integration for subsystems such as IF filters and decoupling components allowing more passive components to be removed from the surface of the substrate. The IDEAS lab is also developing mixed material structures based upon existing multi-chip module (MCM) concepts to further increase package density. The goal of the research is to have very high definition, precise features on the top layer of the substrate typically associated with photolithographic definition, while also having the design flexibility and ruggedness of multilayer ceramic substrates. Known as XOS substrates, the process combines high density interconnect (HDI) technology with low temperature co-fired ceramics (LTCC). HDI substrates are fabricated as the outer layers using thin polymer substrates such as LCP, and are subsequently bonded to an LTCC core. The process will allow designers to utilize the advantages of both HDI and LTCC technologies by allowing HDI component integration on the outer surfaces and high value, high Q passive component integration in the LTCC substrate. The LTCC core also allows for high layer counts to meet the needs of high density interconnect routing.
Eric E. Hoppenjans, Graduate Research Assistant
Purdue University
West Lafayette, IN
USA


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