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Here is the abstract you requested from the Automotive_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Interconnect Solutions for High Performance Automotive Applications
Keywords: Interconnection, High bandwidth, Fine pitch contacts
Twenty Years ago a market research specialist predicted that 60% of the cost of an automobile would be related to electrical and electronic applications. We are probably not far from that prediction in 2007. Furthermore, today we need to reduce size, weight and cost while improving performance and add capability. The latest requirements in automotive applications are pushing the limits of traditional interconnect methods. A new technology that is capable of providing cost effective solutions to automotive interconnection applications is presented here. The Pariposer® interconnect fabric from Paricon Technologies Corp. has the capability to provide low electrical loss interconnection at high frequencies and fine pitch. There are a myriad of electronic application in the automotive industry today that require the performance characteristics of this product. • Low resistance of less than 10 milliohms • High bandwidth performance of over 50 GHz • Fine pitch capability to 0.1mm • RoHS Compliant • Can replace copper contacts • Provides cost effective solutions The basic construction of the Pariposer® interconnect fabric is produced by magnetically orienting silver-plated nickel particles in an organic polymer. The columns of oriented particles are called BallWire® contacts. They form a matrix of Z axis conductive paths with high resistance in the x and y axis. When compressed against plated pads on a PC Board, the fabric, which acts as an incompressible fluid, is displaced around these pads while creating about 6 redundant conductive paths per pad, regardless of the pitch assuring reliable electrical performance. The product performs very well after Thermal and Power cycling and Insertion and Withdrawal testing. This paper will present data to show the performance of the product under these conditions as well as describing its excellent electrical characteristics.
Roger E. Weiss, President and CEO
Paricon Technologies Corp.
Fall River, MA
USA


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