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Small Leadless Packages for Sensors in Automotive Applications
Keywords: Sensor Packaging, Stress Coupling, Reliability
Packaging technology is a key component for modern micromachined sensor devices. It contributes significantly not only to the total product costs, but also to the functionality of MEMS components. In addition, footprint becomes more and more critical as the number of sensors in cars continuously increases. Following the general trend of reducing the size of the MEMS devices to a minimum, the impact of package on the electrical performance of those sensors increases drastically, e.g. due to coupling of mechanical package stress to the MEMS chip. Based on these facts it is pretty clear that MEMS sensor package is a key component and a real differentiator on the market for many applications. A thorough understanding of the influence of material set and detailled package design on the electrical performance and lifetime is a prerequisite to guarantee high precision and high quality sensor products. In this contribution, we will present some key results based on investigations on very small leadless packages like QFN or land grid arrays (LGA) for inertial and pressure sensors.
Dr. Martin Holzmann, Section Manager Sensor Development
Robert Bosch GmbH
Reutlingen, Baden-Württenberg 72762,

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