Here is the abstract you requested from the Automotive_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Plate Level Packaging / Calibration Alternative for Silicon Based for Automotive MAP Sensor|
|Keywords: Plate level packaging, Automotive MAP Sensor, sensor packaging/calibration|
|In this report , we will review a plate level packaging/ calibration technique for automotive MAP sensor application. Also the pros/ cons this approach compared to conventional hybrid packaging will be discussed. Since Sensor packaging and calibration plays such a important role on final product cost / size and performance , we will review the impact of plate level packaging /calibration on manufacturing cost and process as well as IC design for sensor cell as well as compensator IC. Plate level packaging / calibration provide unique set opportunities and challenges for such as problems as Electromagnetic interference or Media compatibilities) for automotive MAP application. This report also review potential for other automotive sensor application which could benefit for this approach.|
|Eddie R. Borzabadi, Sensor Development Engineer