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Suppression of SSN by Embedded Decoupling Capacitor in LTCC Package
Keywords: Decoupling, Capacitor, Digital
In this paper, I present the noise suppresion performance using decoupling capacitor which is embedded in LTCC substrate. To embed high value capacitor(>20nF), high K over 500 material which are cofirable with low K LTCC was developed successfully. Thin high K sheet under 10um was co-laminated with between low K sheet, which forms power and ground plane. Due to its short distance from IC power pin to decoupling capacitor, ESL(Equivalent Series Inductance) is much lower than surface mounted type capacitor, and so, SSN(Simultaneous Switching Noise)can be reduced significantly. To verify the noise suppression performance, we designed and fabricated digial module using 100MHz CPLD(Complex Programmable Logic Device)on top of the LTCC susbtrate in which 30nF decoupling capacitor was embedded. By measurement, we can see that SSN of CPLD on LTCC was reduced by 80% compared with that for using surface mounted type 100nF capacitor. This embedded decoupling capacitor in LTCC(EDCL) can be used for digital SiP(System In Package) to enhance noise performance and to reduce its foorprint.
Yun-Hwi Park, Principal Researcher
Samsung Electro-Mechanics Co., Ltd.
Gyunggi-do, 443-743,
Korea


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