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PZT-Based Thin Film Embedded Capacitors for High Density Printed Circuit Boards
Keywords: PZT Thin Films, Embedded Capacitors, Printed Circuit Boards
Recently, the embedding high-permittivity (highk) dielectric materials using ferroelectric thin films into high density printed circuit boards have been utilized to develop device reliability, manufacturing cost down and make small size products for passive devices. However, many parts of those passive devices include somewhat expensive materials and complicate processing steps. Especially, the electrodes of capacitors, which use an expensive noble metal, have an effect on the product cost rising in typical passive devices. An additional difficulty in developing high-k embedded capacitors is high process temperature. In general, substrates are unable to withstand the high temperatures for inducing the required properties in bulk ceramics or paste derived thick films. To solve these drawbacks, we prepared PZT-based thin film capacitors using chemical solution deposition techniques at low process temperature onto very thin Cu foils or Ni-plated Cu foils instead of noble metal substrates before the embedding process. By incorporating these embedded high-k thin film capacitors into the printed wiring boards, we achieved high capacitance density in the range of ~ 1000 nF/cm2 and the low loss tangent below 1 %. These results represent a remarkable improvement of several orders of magnitude over typical current embedded capacitors in passive devices. Here, we report the experimental results and related possible mechanisms regarding to interfacial layer effect in detail. * This work was supported by Technology Development of Materials and Component Project of the Ministry of the Commerce, Industry and Energy of the Korean Government.
Seung-Hyun Kim, Chief Director
Ansan, Gyeonggi 426-901,

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