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EDA Software Requirements for a Flexible Design of LTCC Circuits
Keywords: EDA software, LTCC & Hybrid circuit design, Interconnect Technologies
- Flexible layer structure for a combination of hybrid (500 layers) and ltcc (up to 50 greentapes with up to 100 assigned information layers per tape) - Creation of unlimited free shaped cavities and fluid channels - Embedded parts at any greentape level on top and bottom side (DIE, BGA, FlipChip, SMD, printed resistors, capacitors, inductors) - Creating a parameterized printed inductor and using it in the layout - Extensive calculation for printed resistors of different shapes - Cuting out portions of a design for reuse - Semiautomatic creation of individual vias in depth and size - Usage of staggered components - Shielding with picket fence and cross hatched ground planes - Creating new components from imported and simulated RF structures - Design for Manufactoring (shrinking, GDSII/GERBER/EXCELLON/Pick&Place-output) - Software interfaces to/from Autocad and others - Combination of electrical and mechanical features (also fluidics) - Using a geometrical and electrical DRC for building individual constraints - Creating company specific documentation - 3D Viewer for LTCC circuits with the complete tape and layer structures.
Horst Durst,
Durst CAD/Consulting GmbH
Holzgerlingen, Baden-Wuerttemberg D-71088,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems