Here is the abstract you requested from the CICMT_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|EDA Software Requirements for a Flexible Design of LTCC Circuits|
|Keywords: EDA software, LTCC & Hybrid circuit design, Interconnect Technologies|
|- Flexible layer structure for a combination of hybrid (500 layers) and ltcc (up to 50 greentapes with up to 100 assigned information layers per tape) - Creation of unlimited free shaped cavities and fluid channels - Embedded parts at any greentape level on top and bottom side (DIE, BGA, FlipChip, SMD, printed resistors, capacitors, inductors) - Creating a parameterized printed inductor and using it in the layout - Extensive calculation for printed resistors of different shapes - Cuting out portions of a design for reuse - Semiautomatic creation of individual vias in depth and size - Usage of staggered components - Shielding with picket fence and cross hatched ground planes - Creating new components from imported and simulated RF structures - Design for Manufactoring (shrinking, GDSII/GERBER/EXCELLON/Pick&Place-output) - Software interfaces to/from Autocad and others - Combination of electrical and mechanical features (also fluidics) - Using a geometrical and electrical DRC for building individual constraints - Creating company specific documentation - 3D Viewer for LTCC circuits with the complete tape and layer structures.|
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