Here is the abstract you requested from the CICMT_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Miniaturization of LTCC Devices by using Mixed Dielectric Substrates|
|Keywords: LTCC, Mixed Dielectrics, Minaturization|
|Low Temperature Cofired Ceramic (LTCC) materials systems and other dielectric materials have been used to fabricate a series of miniaturized, high frequency devices. This paper outlines materials and the strategy for their combination that we have used to achieve miniaturization and unique device function. A general concept that has been applied to device miniaturization is to place high and low dielectric constant materials locally within the structure taking into account electromagnetic field distribution at frequencies of device operation. Co-firing high and low permittivity materials provides unique challenges to match sintering shrinkage and chemical compatibility. Examples of prototype microwave devices will be presented, with emphasis on device modeling and design, prototype construction methods, and electrical test results.|
|Amanda Baker, Assistant research Engineer
The Pennsylvania State University
University Park, PA