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Aerosol Deposition of Integrated Capacitors
Keywords: aerosol, PLZT, Capacitor
Component integration into a volumetrically efficient, robust package is necessary to meet the requirements for next generation technologies in both defense and hybrid vehicle applications. In this work, single and multilayer capacitors were fabricated directly on alumina substrates using an aerosol deposition technique. In this process, PLZT powder is dispersed into an ink, which is then sprayed onto the substrate using a pneumatically operated nozzle. As the ink typically contains less than 2 wt% binder, shrinkage due to organic burnout is minimized, enabling sintering of thick films on previously sintered substrates without cracking. Computer control of the deposition process allows for rapid fabrication of components, with the potential for scale-up to large quantity production. At present, a 1cm2 x 50m thick film can be deposited in under one minute. Integration of PLZT capacitors into a component package can be challenging; at typical sintering temperatures (1200 C 1300 C) there is significant diffusion of lead into the alumina substrate. This can lead to poor adhesion of the capacitor to the substrate, as well as drastically reduced electrical properties. Techniques such as chemical processing of sub-micron precursor powders as well as liquid flux additives have enabled the sintering temperature to be reduced by several hundred degrees, minimizing lead diffusion. Using these materials and techniques, large area (15cm^2) thick film capacitors have been fabricated on alumina substrates. Capacitances in excess of 400 nF were achieved devices having 50 micron thick layers sintered at 950C. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energys National Nuclear Security Administration under contract DE-AC04-94AL8500.
David Williams, Post-Doctoral Appointee
Sandia Laboratories
Albuquerque, NM
USA


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