Here is the abstract you requested from the CICMT_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Post-Bonding and Fabrication of Low Temperature Co-Fired Ceramic|
|Keywords: Post-Bonding, Fabrication, Sensor|
|Multilayer devices made from LTCC are a challenge to fabricate because of the many layers involved in the structure of the device. The need for a larger device came from an ion mobility spectrometer (IMS) that needed to be longer in length for “time of flight” of the ions to increase. The idea was to hermetically bond the device with strength and to bridge the electrical connections across the bond. A glass encapsulate paste made by Dupont was used to bond together two 192 layer post-fired drift tubes used in the IMS. The miniaturization and lengthening of the drift tube has resulted in a drift tube with approximately 50 conductive rings in one centimeter. Conductive paste is used to electrically connect in the post-fire bonding. Before the drift tube was completed many tests were conducted to determine the best firing time and temperature. Tests of the conductivity, leaks, and bonding strength were also preformed. Conductivity and strength of the bond were very good, but it leaked. A covering was made for the outside of the IMS to keep it from leaking. For the fabrication, conductive paste is applied to the areas needed, covered, and then the glass paste is dispensed to the remaining areas. This is done to only half of the device and the other half is placed on top. The entire system is placed in the furnace and fired up to a temperature needed for the conductive paste to fire completely. Several images will be presented to illustrate the post-fired bonding process. This glass encapsulate process could also be used to embed other elements inside of cavities, bonding of very small systems, and to improve the development of other devices.|
|Hope Weston, Student
Boise State University