Micross

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Embedded Passives Fabricated on LTCC and Application of Photo-imageable Thick Film Technology
Keywords: co-firing, embedded passives, photo-imageable
Embedded capacitors and inductors were designed and fabricated on the zero-shrinkage LTCC tape using thick-film lithography technology with photo-imageable LTCC and conductor pastes. The micro-scale capacitors and inductors libraries were designed using 3D EM simulation and modeling based on the materials parameters of LTCCs and conductors. The lithographic patterns were designed based on the material parameters and process capability of line and space, or via-hole with a resolution of 50um or 75um design rule. The test pads of the each component were located on the same layer. The laboratory scale photo-imageable Ag conductor paste and Low-K LTCC pastes were fabricated and printed on the commercially available zero-shrinkage tape and the micro-patterning was made using photolithography, then the samples were co-fired at the temperatures under 900 degree C. The structure and electrical properties of lithographically made L and C devices are compared with conventionally screen printed patterns with 100um design rule. And the distributed elements for Ka-band were designed and fabricated using this technology.
Hyo-Tae Kim, Principle Researcher
Korea Institute of Ceramic Engineering and Technology
Seoul 153-801,
Republic of Korea


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