Here is the abstract you requested from the CICMT_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Anodic Bondable Glass-Ceramic LTCC Tape|
|Keywords: LTCC material, Anodic bondable to silicon, adopted TEC|
|Glass-ceramic LTCC tapes are used as supports for multi layer components in microtechnology. A novel glass-ceramic LTCC tape for anodic bonding with a coefficient of thermal expansion (TEC) close to that of silicon were developed. The green tapes can be processed with thin film and LTCC technologies. The processing of raw materials is a key step in the preparation of the novel tapes. A new procedure of material preparation is adopted to realize very fine-grained powders which are processible with tape casting techniques. The composition of the glass-ceramic tape was optimized by partial substitution of the key ingredients alumina and borosilicate glass by α-min glasses, cordierite and Na+ glasses. Different material combinations were investigated. A material system based on borosilicate glass, Al2O3 and cordierite was selected as the optimal combination with excellent bondability and physical properties (e.g. dielectric constant). The TEC of this material is 3.4 ppm/K. The surface roughness of laminated and sintered LTCC-tapes is 200 nm.|
Hermsdorfer Institut für Technische Keramik e.V.
Hermsdorf, Thuringia 07729,