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High K Embedded Thin Film Capacitor for PCB Application
Keywords: thin film, embedded capacitor, printed circuit board
A novel bismuth zinc niobate (Bi1.5Zn1.0Nb1.5O7, BZN) thin film was studied as an embedded capacitor. The BZN thin films were prepared on electroplated copper substrate by RF sputtering, which is compatible with low-temperature PCB processing. The deposited BZN thin films were deposited without substrate heating. The films were composed of an amorphous phase. Dielectric properties of the BZN thin films measured using Au/BZN/electroplated copper substrate structure were strongly dependent on deposition conditions. Very high dielectric constant of ~100 was obtained for the amorphous BZN thin films. The leakage current and capacitance density were <1 uA/ at 3 V and 300 nF/cm2, respectively. The deposited films were characterized by various techniques such as EPMA, Raman spectroscopy and x-ray photoelectron spectroscopy and correlated with their dielectric properties. The process-compatibility of BZN thin films with PCB was also studied.
Jung Won Lee, Principal Researcher
Samsung Electro-Mechanics Co., Ltd.
Suwon, Gyunggi-Do 443-743,
Korea


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