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The Application of SEMI E142 for Single Device Traceability
Keywords: SEMI E142 Standard, Wafer & Strip Mapping, Single Device Tracking/Traceability
SUBMITTED TO FlipChip area also: There is a new standard (SEMI E142) that addresses the mapping of complex substrates (e.g. multi-project wafers, stacked packages, PCBs). The substrate maps include information about the individual and composite device bin codes, 2D matrix laser marks and substrate to substrate transfers. With this standard it is now possible to track single devices through the assembly process. Correlating final test results and field failures at the device level with the exact manufacturing conditions under which that device was manufactured as well as its precise location on the wafer, strip and tray on which it was processed, allows reduced cycle time, reduced scrap, rapid resolution of defect trends and increased yield. IC manufacturers have now started to implement E142 to realize these benefits. In this presentation we will study the E142 Standard, its application for wafer/strip/tray mapping and single device traceability (SDT), based on real examples. We will also explore the cost benefit for SDT for several applications.
Dave Huntley, President
Kinesys Software
Petaluma, CA
United States


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