Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Application of SEMI E142 for Single Device Traceability|
|Keywords: SEMI E142 Standard, Wafer & Strip Mapping, Single Device Tracking/Traceability|
|SUBMITTED TO FlipChip area also: There is a new standard (SEMI E142) that addresses the mapping of complex substrates (e.g. multi-project wafers, stacked packages, PCBs). The substrate maps include information about the individual and composite device bin codes, 2D matrix laser marks and substrate to substrate transfers. With this standard it is now possible to track single devices through the assembly process. Correlating final test results and field failures at the device level with the exact manufacturing conditions under which that device was manufactured as well as its precise location on the wafer, strip and tray on which it was processed, allows reduced cycle time, reduced scrap, rapid resolution of defect trends and increased yield. IC manufacturers have now started to implement E142 to realize these benefits. In this presentation we will study the E142 Standard, its application for wafer/strip/tray mapping and single device traceability (SDT), based on real examples. We will also explore the cost benefit for SDT for several applications.|
|Dave Huntley, President