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Solder Die Attach and Evaluation of the Solder Joint
Keywords: solder, measurement, correlation
In order to evaluate the quality of a solder die attach process, robust measurement methods are needed. Four measurement methods, two destructive and two non-destructive, were evaluated. The four methods chosen for verifying the solder joint quality included X-ray, die shear, acoustic imaging and cross section. Furthermore, it was not known how well the output of these measurement methods correlated with each other. At the time of the evaluation, X-ray was proven to not be a viable measurement method. Die shear, acoustic imaging and cross sectioning proved to be viable and usable measurement methods. After comparing the die shear, acoustic image and cross sectioning results, it was determined that these three methods did validate each other. There was an approximately 83% correlation between the acoustic images and the die shear failure modes. There was a significant correlation between the acoustic measurements and shear forces. In addition, there was a 95% correlation between the acoustic image data and the cross sectional data.
Randy Hamm, Senior Engineer
Honeywell Federal Manufacturing & Technologies
Kansas City, MO

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic