Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Science, Materials, and Process Technology of Cu Bonding for 3D Integration|
|Keywords: Cu bonding , 3D integration, Process development|
|Highlights of the presentation: 1. Science of Cu bonding 2. Applications of 3D integration using Cu bonding technology 3. Process development 3. Technology integration 4. Future directions|
|Kuan-Neng Chen, Research Staff Member
IBM T. J. Watson Research Center
Yorktown Heights, NY