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Science, Materials, and Process Technology of Cu Bonding for 3D Integration
Keywords: Cu bonding , 3D integration, Process development
Highlights of the presentation: 1. Science of Cu bonding 2. Applications of 3D integration using Cu bonding technology 3. Process development 3. Technology integration 4. Future directions
Kuan-Neng Chen, Research Staff Member
IBM T. J. Watson Research Center
Yorktown Heights, NY

  • Amkor
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