Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Vertical Interconnects for Stacked Die using Micro Dispensing|
|Keywords: Vertical Interconnects, Stacked Die, Micro Dispensing|
|Vertical interconnecting for stacked die has challenged a variety of technical approaches. nScrypt will present a method using micro dispensing of a viscous conductor, demonstrating the necessary control in both volume and space. Dispensing for packaging has been common, but the packages have been large, therefore it is a critical step to control the volume to 10’s of picoliters through a dispensed orifice to obtain the necessary tolerances for smaller pads and tighter pitches which exist on stacked die. The micro dispensing approach has demonstrated very fine features, less than 50 microns, given the proper material. Explanations on the limits of materials will be presented as given by particle size and post processing temperatures with regard to micro dispensing and vertical interconnects. Printing vertically on multiple sides will be demonstrated along with a detailed explanation of the necessary spatial control for the resolution that will match the die level as opposed to resolutions matching much larger packages. As the stacked die change the pattern for connection or the number of stacks change, the advantage this approach brings is the Computer Aided Dispensing control. This implies no masks and the ability to change from part to part without expensive tool redesign time.|
|Dr. Dongjiang Xu , Research & Development Engineer