Abstract Preview

Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Photoresists for 3D-Packaging - Challenges and Solutions
Keywords: Photoresist, 3D-Packaging, Lithographic Performance
3D-packaging technology is a cost-competitive solution to manage the increasingly limited 'real estate' available in consumer applications. One major challenge is through silicon via (TSV) formation using the Bosch process. The alternating and repeated use of etching and passivation chemistries poses various challenges to photoresist design, such as excellent resolution, vertical profiles, high etch resistance, and simple removal. We discuss lithographic properties and performance of a new negative resist concept designed for full compatibility with the Bosch process with excellent coating uniformity over a film thickness range from < 10 to > 120 um and aspect ratios exceeding 5:1. The material combines short process times with excellent etch resistance and residue-free removal with standard strippers, thus facilitating the most challenging process of advanced 3D-packaging concepts.
Georg Pawlowski, Senior R&D Manager
AZ Electronic Materials Corporation USA
Somerville, NJ

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems