Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Trends and Challenges of SiP Design|
|Keywords: SiP , Packaging, Design|
|Advances in IC speeds, pin counts and densities are on a collision course with an electronics company's need to design products in shorter times with optimal performance. Mr. Viklund will discuss the challenges and emerging design methodologies for today's and future SiPs. Design technology that spans from IC to package to PCB systems and enables concurrent design collaboration among the multiple design disciplines and organizations. He will talk to the need for more automation and functionality in the design of single IC and SiP packages, the ability to analyze and optimize performance at the systems level, a method of implementing design collaboration between the package and systems' designers, and, revolutionary design technology that could be applied to the design of ICs and their packages. Bio: Per Viklund is Director of IC Packaging at Mentor Graphics responsible for IC packaging, RF Design, and Embedded components product lines. He is a long time IEEE & IMAPS member with more than 25 years experience with electronic design and has spent the last 20 years with design of advanced EDA tools. He has published several papers on IC Packaging, Embedded passives, RF and high speed design. Prior to joining Mentor, Viklund was chief technical manager of DDE-EDA for 10+ years.|
|Per Viklund, Director of IC Packaging