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Emerging IC and Systems Packaging Technology Trends
Keywords: 3D, Systems Packaging , Emerging Device
This paper reviews a number of emerging packaging technologies in the context of SOC, SIP and SOP. These include: IC-package co-design for mixed functions Interconnection and assembly to fine pitch Cu-ultra low K Integrated substrate with micro to nanoscale embedded components: o digital functions o optical functions o RF functions o bio functions Integrated module with embedded actives and passives Wafer level SIP and 3D packaging
Dr. Rao R. Tummala , Chair Professor & Emminent Scholar
Georgia Institute of Technology
Atlanta, GA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic