Here is the abstract you requested from the DPC_2007_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Emerging IC and Systems Packaging Technology Trends|
|Keywords: 3D, Systems Packaging , Emerging Device|
|This paper reviews a number of emerging packaging technologies in the context of SOC, SIP and SOP. These include: • IC-package co-design for mixed functions • Interconnection and assembly to fine pitch Cu-ultra low K • Integrated substrate with micro to nanoscale embedded components: o digital functions o optical functions o RF functions o bio functions • Integrated module with embedded actives and passives • Wafer level SIP and 3D packaging|
|Dr. Rao R. Tummala , Chair Professor & Emminent Scholar
Georgia Institute of Technology