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Emerging IC and Systems Packaging Technology Trends
Keywords: 3D, Systems Packaging , Emerging Device
This paper reviews a number of emerging packaging technologies in the context of SOC, SIP and SOP. These include: IC-package co-design for mixed functions Interconnection and assembly to fine pitch Cu-ultra low K Integrated substrate with micro to nanoscale embedded components: o digital functions o optical functions o RF functions o bio functions Integrated module with embedded actives and passives Wafer level SIP and 3D packaging
Dr. Rao R. Tummala , Chair Professor & Emminent Scholar
Georgia Institute of Technology
Atlanta, GA
USA


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