Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Lead-Free Flux Cleaning Problem and its Solution|
|Keywords: Cleaning Process, Lead Free Solder Paste, Cleaning|
|Arakawa Chemical Industries Ltd. is the chemical company, which its origin comes from rosin products in 130 years ago. Based on its technology and experience, the total solution of flux, lead free solder paste, deflux solvent, and cleaning machine is invented. In the packaging field, residue problem has been observed since lead free solder paste is introduced in the market. Also, the another residue, comes from the lead rich solder, has been found caued by the different formation. This paper is discussed about the causes and its solution in the field of WLCSP, Interposer, and flip chip packages.|
|Kunihiko Okaoto, Assistant Manager
Arakawa Chemical Industries Ltd.
Chuo-ku, Tokyo 103-002,