Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low Temperature Curable Photosensitive Polymer Dielectric for Wafer Level Packaging Applications|
|Keywords: Low cure temperature, High elongation, Photosensitive|
|Properties and processability of a new class of photodefinable thermosetting fluorinated polymer are described. This polymer is suitable to dielectric material for wafer level packaging and high density interconnect of temperature sensitive devices since it is designed to thermally crosslink at around 200C, lower than the temperature required to cure conventional polymer dielectrics such as PI, PBO and BCB. Cured film of the polymer possesses excellent electrical properties(low dielectric constant), mechanical properties(high elongation at break and tensile strength), heat stability, adhesion (onto substrates and to upper-layers), capability of multiple coating and chemical durability as well as low moisture uptake. The typical elongation value of this polymer is 15%~30% depending on its crosslinking density. This value is much higher than that of epoxy resin, a well-known low cure temperature thermosetting polymer. This polymer can be dissolved in conventional solvents and uniform thick film(~20um) can be easily obtained from its solution. The formulation of negative-tone and solvent developable grade contains the polymer and photosensitizing agent and is optimized not to deteriorate the excellent properties of the polymer. The processing conditions such as spin, soft bake, exposure, develop and cure are described and discussed from the viewpoint of reliability and process requirements for wafer level packaging and high density interconnect.|
|Takeshi Eriguchi, Senior Researcher
Asahi Glass Co., Ltd.
Yokohama, Kanagawa 221-8755,