Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|MPF(TM) Microlithographic Polymer Film - A Dry Film Solution for Advanced Packaging|
|Keywords: Thick Photoresist, Dry Film, Wafer Level Processing|
|This paper describes the development and performance of new dry film based photoresist materials, Microlithographic Polymer Films (MPF) for applications in advanced packaging. An overview of primary applications for thick (100-120 microns) and thin (10-30 microns) MPF is presented, and pro’s and con’s of the new materials are contrasted vs. existing material sets. The performance and process flow for MPF is described for various types of processes on a wafer level. Data is presented from experiments with typical off contact, or soft contact, mask aligners and steppers, as well as newly developed maskless direct imaging processes. Compatibility of MPF with existing and new high productivity metal deposition processes is reported. Finally a cost of ownership model (COO) is presented for MPF, to describe the overall cost of using these new materials both regarding capital investment and processing cost.|
|Pedro Jorge, Senior Product Manager
Research Triangle Park, NC