Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Recent Developments in Flip Chip Lid Adhesives|
|Keywords: Lid seal adhesive, Flip chip adhesive, Heat spreader adhesive|
|More and more flipchip assemblies are requiring lids or integrated heat spreaders in order to dissipate the heat that is generated by the flip chip die. The types of adhesives needed for these assemblies require a very specific and different set of properties than other adhesives used in microelectronics. The technology of these adhesives has had to evolve in order to meet the latest needs of advanced flip chip applications. These technical improvements in the adhesive properties are a major contributor to the overall performance and reliability of the assembled flip chip device. This presentation will discuss the technical hurdles in formulating suitable adhesives for flip chip applications and the key technical advances that enable their success. Significantly among these are test method development (lid shear, die shear, lid pull, and lid torque) and other analyses to understand fundamental failure modes for baseline adhesive performance. From this adhesion data, optimization of the lid adhesive properties can be demonstrated -specifically the improved performance for multiple lead-free reflow conditions, robustness for surviving various environmental conditions, and the compatibility with common lid and heat spreader materials (e.g. electroless nickel on copper, various electrolytically deposited substrates, aluminum, ceramic, etc). Additional data from actual flip chip assemblies will be shown to demonstrate the overall robustness of the adhesive in commercial use.|
|Lyndon Larson, Engineer