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Preliminary Manufacturability & Reliability Data for 150m Pitch Pb-Free Plated Interconnect FC using 65m Low-k Silicon
Keywords: Flip Chip, Fine Pitch, Pb Free
As the bump pitch decreases, the challenge for manufacturing flip chip devices increases dramatically. In addition, the changes in geometries affect the stresses seen on individual bumps as well as the overall silicon. In order to identify if there is major development work required, preliminary builds are built and stressed to determine if the current processes and material sets are suitable for the new technology. This paper and presentation focuses on this preliminary evaluation and the reliability results achieved to date.
Lou Nicholls, Director, Flip Chip Products
Amkor Technology, Inc.
Chandler, AZ
USA


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