Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Preliminary Manufacturability & Reliability Data for 150µm Pitch Pb-Free Plated Interconnect FC using 65çm Low-k Silicon|
|Keywords: Flip Chip, Fine Pitch, Pb Free|
|As the bump pitch decreases, the challenge for manufacturing flip chip devices increases dramatically. In addition, the changes in geometries affect the stresses seen on individual bumps as well as the overall silicon. In order to identify if there is major development work required, preliminary builds are built and stressed to determine if the current processes and material sets are suitable for the new technology. This paper and presentation focuses on this preliminary evaluation and the reliability results achieved to date.|
|Lou Nicholls, Director, Flip Chip Products
Amkor Technology, Inc.