Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wafer Level Packaging - Bringing Size and Performance Benefits to an Expanding Application Space|
|Keywords: Wafer Level Packaging, WLCSP Applications, Market Trends|
|With the sharp increase in the world’s demand for portable electronics, the need to make semiconductors smaller, faster, lighter and cheaper has become greater than ever before. Despite continued advances in traditional semiconductor packaging technologies, these packages are not able to meet all of the needs of the mobile electronic device manufacturers. Wafer level packaging is rapidly being embraced by leading semiconductor manufacturers to provide the smallest possible, highest-performing devices. Wafer level chip scale packages (WLCSP) have begun to appear in a variety of well-known portable electronics products ranging from MP3 players to cell phones. WLCSP’s are now being pushed beyond historical limits in regards to larger die sizes, adoption on low-k materials, finer bump pitches, higher I/O counts and thinner package profiles. This presentation will examine factors driving the rapid adoption of WLCSP’s, market opportunities, current applications, and economic considerations. Recent advances in Amkor’s CSPnlTM WLCSP technology offerings, supported by related reliability data, will also be included.|
|Ravi Chilukuri, Sr. Product Manager, WLCSP
Amkor Technology Inc.