Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|SolderJet® for Flip Chip and Wafer-Level Packaging|
|Keywords: Flip Chip , Wafer-Level Packaging, SolderJet|
|High temperature ink-jet based printing processes have been developed for the fabrication of high-density microelectronic and optoelectronic packages, including MCMs and CSPs. The enabling technology for this work has been the development of a printhead that accurately dispenses picoliter volumes of solders to polymeric formulations at operating temperatures up to 300ƒµC. The inherently data-driven nature of MicroJet processes leads to a higher level of process integration, lower cost, and increased flexibility. Potential applications of MicroJet processes include: integrated circuit packaging, chip scale packaging, sealing wafer level packages, optoelectronic interconnect fabrication, and printed circuit board manufacturing. Using commercial, print-on-the-fly printing platforms, droplets of a variety of lead free solders have been dispensed and placed onto pads, at rates of over 400 bumps/sec. Solder sealing rings have been printed to enable hermetic sealing at the wafer level reducing the percent of silicon used for sealing. 3D interconnects and vertical vias have also been printed. Similarly, polymer formulations have been utilized in the printing of micro-optics, dielectric coatings, and electronic adhesives.|
|Donald J. Hayes, President
MicroFab Technologies, Inc.