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Analysis of Non-ENIG Pad Finish on Solder Joint Reliability
Keywords: Flip Chip, Reliability, SOP
This paper studies and analyzes the SOP pad finish and its effects on intermetallic growth and the resulting solder joint. For the study, both Pb-free and SnPbAg solder balls with SnAgCu SOP finish were thermally aged. The SnPb and Pb-free alloy package components were stressed at 150C for up to 1008 hours. The solder ball shear, temperature cycling (0/100C), shock tests, and monotonic bend tests were performed. The relationship between failure rate, failure mode, stressing, IMC formation rate, and test conditions are discussed.
Tim Pham , Assembly Integration Engineer
Freescale Semiconductor
Austin, TX
USA


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