Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Analysis of Non-ENIG Pad Finish on Solder Joint Reliability|
|Keywords: Flip Chip, Reliability, SOP|
|This paper studies and analyzes the SOP pad finish and its effects on intermetallic growth and the resulting solder joint. For the study, both Pb-free and SnPbAg solder balls with SnAgCu SOP finish were thermally aged. The SnPb and Pb-free alloy package components were stressed at 150C for up to 1008 hours. The solder ball shear, temperature cycling (0/100C), shock tests, and monotonic bend tests were performed. The relationship between failure rate, failure mode, stressing, IMC formation rate, and test conditions are discussed.|
|Tim Pham , Assembly Integration Engineer