Here is the abstract you requested from the DPC_2007_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Recent Business and Technology Developments in Flip Chip|
|Keywords: Flip Chip, Substrate, Bumping|
|Flip chip interconnect has been adopted for a variety of applications. The drivers for flip chip continue to be performance and form factor. Flip chip interconnect is expanding into many device types ranging from high performance logic to a variety of devices found in wireless products. An increasing number of suppliers of ASICs, field programmable gate arrays (FPGAs), DSPs, chipsets, graphics, and microprocessors are expanding their use of flip chip in package (FCIP). While flip chip on board (FCOB) continues to be an important application, most of the growth can be seen in FCIP. Examples of the type of devices increasingly used as FCIP are provided, including system-in-package (SiP) The limiting factor in the greater expansion of flip chip has been the shortage of laminate substrates, but this situation should improve dramatically in 2007 as is explained in this presentation. Lower substrate prices may expand the market for flip chip in a variety of applications that have previously been designed only in wire bond.|
|Ms. E. Jan Vardaman , President, Senior Analyst
TechSearch International, Inc.