Here is the abstract you requested from the DPC_2007_MEMS technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fabrication and Characterization of Wafer-Level Micro Package(WLμP)|
|Keywords: Wafer level package, Thin wafer handling, MEMS|
|In this study, we propose to Wafer Level Micro Package(WLμP®) as MEMS package. we could develop to WLμP® which have air cavity for moving parts of MEMS. With using this process, we could make a small size package(0.85*0.65*0.25um). Film Bulk Acoustic Resonator(FBAR) was used as reference for performance characterization. Three key technologies of this, are 1. a thin wafer(T ~135um) handling for protection of wafer broken in process, 2. wafer bonding for protection of water penetration on high humidity and temperature, and 3. bilateral face-MEMS fabrication technology for Interconnection. To fabrication of successful WLμP®, we solved many problems by using 6 sigma® tools, and we could accomplished to our goal. In this paper, we present the nice results of reliability(All Pass), good performance of the smallest WLμP® - Reliability reference Pressure cooked test(121℃, 100%, 96hous) Temperature cycling(-55℃~125℃, 500cycles) Precon : TC(5cycles), Baking(125℃, 24hours), Humidity asorption(85%, 85℃, 24hours), Reflow(265℃, 3cycles) - Performance reference Insertion loss degradation before/after WLμP® RF characterization difference before/after WLμP®|
Samsung Advanced Institute of Technology
Yongin City, Gyounggi-Do 446-712,