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Air Cavity Plastic Packaging, the New Near Hermetic Flexible Platform for Base-Station Microwave Applications
Keywords: Flexibility, Reliability, Platform
The LCP air cavity technology to be presented represents a breakthrough in semiconductor electronic packaging. The new low cost injection molded packaging process allows the user to combine the thermal advantages gained by using a eutectic die attach material between die and backplane, with a moisture resistant LCP sidewall specifically designed to manage the higher power and frequency output values previously found only in ceramic packaging systems/ technology. The technology is based on new Liquid Crystal Polymer (LCP) materials that have been specifically developed to handle the thermal and environmental demands of high performance electronic enclosures. By combining three-dimensional molding with lead-frame technology, the packages can incorporate the freedom and flexibility allowed when used with different base materials, plating and package designs. This combination of LCP new molding technology and multi-site semiconductor leadframe formats supports high rate and high efficiency industrial production. It allows a flexible platform that allows multiple customer specific designs without increasing the package pricing when compared to ceramic packaging technologies. The combination of extraordinary properties of the design created new opportunities for the high power RF design group for NXP cellular basestations. Accelerating the development of the technology to a higher level, the partners improved the technology on several levels, created new testing methods to support the final qualification. This presentation will detail the materials used, their individual characteristics, and their performance as a fully integrated system. The advantage of the flexibility of the design will be explained based on various NXP developmental and production products showing the route to qualification, test results and improvements made. Final production release added value for packaging of NXP base-stations products confirming that the technology is more than just an interesting concept.
Mr. Raimond L. Dumoulin, Principal Packaging and Assembly Engineer
NXP Semiconductors
Nijmegen 6534 AE,
The Netherlands

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