Here is the abstract you requested from the DPC_2007_Mems technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Sealing of MEMS Device Cavity: Thermo Mechanical Considerations|
|Keywords: MEMS , Thermo-Mechanical , Packaging|
|Packaging is a very important aspect of a MEMS product because it will have a significant impact on cost as well as design. Packaging  provides the function of connecting the chip and the external environment, mechanical support for the MEMS device, electrical connections, heat dissipation and environmental protection. The commercialization of the MEMS product is dependent on the package providing these functions at a competitive cost. Because a MEMS device can be used for many applications, the packaging will often be redesigned for these different applications. One direction to achieve lower cost packages has been to pursue wafer level and chip scale packaging. Advances in packaging industry include wafer level and chip scale packaging of MEMS devices with several material combinations, silicon–to-silicon, silicon–toceramic, silicon-to-glass [2, 3], ceramic–to-ceramic. In these cases of wafer level sealing, the MEMS device is subjected to a high temperature that can change the performance of a device or render the device non-functional. In this paper, we apply localized laser sealing [4, 5, 6, 7] to ceramic packages, so that we avoid subjecting the MEMS device to high temperatures. The use of ceramic packages is consistent with the product intent for RF applications.|
|Dr. Ajay P. Malshe , Associate Professor
University of Arkansas (HiDEC-MEEG)