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Ultra High Thermal Dissipation of High Power Light-Emitting Diodes by Copper Electroplating
Keywords: Ultra High Thermal Dissipation, High power light emitting diodes, Package with Copper Electroplating
The thermal management has become increasingly important when comes to device applications using high power light emitting diodes (LEDs). To thermally manage the devices in a most effective fashion, we report a novel packaging technique in which a copper electroplating process is directly applied over the red, green, and blue LED chips. With the copper-encapsulated layer, the injection current subsequently administered to these LED chips can be increased easily from a conventional 350 mA to more than 1050 mA at room temperature. This process can be well adapted to AlInGaP-based red LED when its working current can be driven all the way up to 1650mA. At 350 mA, the relative luminous intensity of these specially packaged red, green, and blue LEDs (RGB LEDs) clearly demonstrate a corresponding enhancement of 53%, 69%, and 23% when compared to those of conventionally packaged LEDs. Furthermore, as the injection current of these LED chips increases to 850mA, the respective improvement in relative luminous intensity of these RGB LEDs chips becomes 431%, 83%, and 18%, when compared to those of the conventional packaged devices.The surface temperatures of the novel and the conventional packaged LEDs were measured by a thermal couple at different injection current. As the injection current at 350 mA, 500 mA, and 700 mA, the surface temperatures of the conventional packaged LEDs were 71 oC, 95 oC, and 134 oC respectively, and the surface temperatures of the novel packaged LEDs were 49 oC, 64 oC, and 84 oC respectively. As the injection current increased to 1 A, the surface temperature of the novel packaged LEDs were 123 oC. In summary, the novel package method has successfully resolved the heat dissipation issue facing the ultra high power RGB LEDs.
Kuan-Chun Chen, Student
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
Tainan 70101,

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