Device Packaging 2019

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The Development and Manufacture of a Linear 16 Pixel FIR Array - The PACS Module
Keywords: FIR array, Cryogenic electronics, cryo-conducting glue
The high and low stressed PACS modules (linear 16 pixel arrays) are the basic constituents of MPE’s (Max Planck Institute for Extraterrestrial Physics) 16x25 pixels FIR cameras of PACS (Photodetector Array Camera and Spectrometer) on board of the HERSCHEL satellite. The essential principles for the stress application and pixel stacking technique originate from ISOPHOT and FIFI LS (SOFIA) detectors. Challenges for the PACS module “packaging” were the drastic reduction of heat dissipation from the 4-5 K Front-End-Electronics (FEE) and harness substrates to the module body at about 1.8 K. The FEE with the cryogenic read-out electronics (CRE) is contributed by IMEC. The substrates are suspended with 25 mm wall thickness polyimide tubes within the Al alloy spring of the module. Electrical connections from the FEE/harness to the pixels in the cavity and temperature sensor on the module body are effected via 25 mm stainless steel wires fixed on respective pads with a Ag filled glue stable and low ohmic at cryogenic temperatures. The assembly tolerates launch load vibration levels (20 g). 100 flight grade PACS modules (50 low +50 high stressed) were manufactured. The 2 flight model cameras have been finished in Spring 2006 at MPE.
Hilmar H. Richter,
ASTEQ Applied Space Techniques GmbH
D-65779 Kelkheim,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
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  • Raytheon
  • Specialty Coating Systems
  • Technic