Here is the abstract you requested from the ExCold_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Qualification of Hardware for JPL/NASA Projects Under Extreme Temperatures to Assess Reliability and to Enhance Mission Assurance|
|Keywords: Hardware qualification, extreme temperatures, Package qualification, package reliability, Thermal cycling|
|Package Qualification Verification (PQV) of advanced electronic packaging and interconnect technologies and various other types of qualification hardware for Mars Exploration Rover/Mars Science Laboratory flight project has been performed to enhance the mission assurance. The qualification of hardware under extreme cold temperatures has been performed with reference to various project requirements. The flight-like packages and subassemblies have been selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations and mission phases. Qualification has been performed by subjecting above flight-like qual hardware to the environmental temperature extremes and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.|
|Rajeshuni Ramesham, Senior Member Engineering Staff
Jet Propulsion Laboratory, California Institute of Technology