Here is the abstract you requested from the ExCold_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low Temperature, Thermal Cycle Electronic Packaging Survivability Study for Brushless Motor Drive Electronics|
|Keywords: Low Temperature, Packaging, Chip on Board|
|Electronic packaging technology for Brushless Motor Drive Electronics is being developed to withstand low temperature, fatigue conditions on Mars, 2010 cycles from -130 to +85C. This temperature regime and number of cycles exceeds typical mil standard testing from -55 to +125C. This technology will benefit future rovers for several reasons such as, the electronics will not require heater power and will be able to traverse longer distances. The complexity of the cable wiring as well as thermal leaks that occur in the current warm electronics box (WEB) design will be eliminated. This presentation will describe the material combinations of several Chip on Board (COB) die, passives, and bus wire components that have been tested and have survived, as well as the failure mechanisms found throughout the thermal cycling regime.|
|Carissa D. Tudryn, Mechanical Engineer
Jet Propulsion Laboratory, California Institute of Technology