Device Packaging 2019

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Low Temperature, Thermal Cycle Electronic Packaging Survivability Study for Brushless Motor Drive Electronics
Keywords: Low Temperature, Packaging, Chip on Board
Electronic packaging technology for Brushless Motor Drive Electronics is being developed to withstand low temperature, fatigue conditions on Mars, 2010 cycles from -130 to +85C. This temperature regime and number of cycles exceeds typical mil standard testing from -55 to +125C. This technology will benefit future rovers for several reasons such as, the electronics will not require heater power and will be able to traverse longer distances. The complexity of the cable wiring as well as thermal leaks that occur in the current warm electronics box (WEB) design will be eliminated. This presentation will describe the material combinations of several Chip on Board (COB) die, passives, and bus wire components that have been tested and have survived, as well as the failure mechanisms found throughout the thermal cycling regime.
Carissa D. Tudryn, Mechanical Engineer
Jet Propulsion Laboratory, California Institute of Technology
Pasadena, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic