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Wire Bonding to Ultra-Thin Stacked Die Devices with Overhang
Keywords: wire bonding, stack die, overhang
3D stack die device with overhang has been widely applied to form system in package (SiP). The requirements of increasing stack number and limited package thickness drive ultra-thin stack die with larger overhang distance, which challenges wire bonding feasibility. This article illustrated the inherent mechanisms of wire bonding in the application of ultra-thin overhang stack die device, from deflection caused by bond force to wire bonding process characteristics. The bonding results showed that the wire bonding is applicable to ultra-thin overhang devices by carefully implementing process requirements stated in this article. Light is also intensively shed on test methodologies to address special attention in overhang die application.
Jovy Michael G. Sena,
Oerlikon USA, Inc.
Tempe, AZ
USA


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