Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bonding to Ultra-Thin Stacked Die Devices with Overhang|
|Keywords: wire bonding, stack die, overhang|
|3D stack die device with overhang has been widely applied to form system in package (SiP). The requirements of increasing stack number and limited package thickness drive ultra-thin stack die with larger overhang distance, which challenges wire bonding feasibility. This article illustrated the inherent mechanisms of wire bonding in the application of ultra-thin overhang stack die device, from deflection caused by bond force to wire bonding process characteristics. The bonding results showed that the wire bonding is applicable to ultra-thin overhang devices by carefully implementing process requirements stated in this article. Light is also intensively shed on test methodologies to address special attention in overhang die application.|
|Jovy Michael G. Sena,
Oerlikon USA, Inc.