Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Component vs. System Level Analysis using CFD|
|Keywords: CFD, component, system|
|In this study, research was conducted to observe the cooling performance of a typical microprocessor heat sink in forced convection regimes of operation. A component level analysis was completed and results were paralleled with the behavior of the radiator as part of a complete system. Laminar convection and constant heat dissipation were targeted. The CFD simulations were performed for several power levels and ambient air characterized by a Pr=0.71. Numerical results showed a slightly higher heat sink thermal resistance (in both cases), however the predicted resistance trend matches the experimental trend documented. In conclusion, the author stresses the utility of CFD analysis at both component and system level emphasizing and comparing the accuracy of the results.|
|Virgil C. Ganescu, PhD, Chair, School of Electronics Technology
Owings Mills, MD