Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Innovative Way of Shielding for RF Applications at Package Level|
|Keywords: Conformal Shield, EMI Shielding, RF|
|There are many different shielding technologies available for shielding in Radio Frequency (RF) applications. We compare these different RF shielding technologies and discuss an innovative way of providing RF shielding at the package level. This novel concept provides improvements in form factor, easy of use and cost compared to traditional shielding approaches. A comparison is made between traditional board level approaches like metal cans or lids and emerging package level technologies such as conductive paint, formed shields and conformal plating. Electrical performance, manufacturability, and reliability between the different packaging technologies is also discussed. A thorough look at the advantages and limitations between these different shielding technologies is also shown. All of the shields must provide protection from RF interference. Key words: RF Shielding, Radio Frequency, RF, Conformal Shield, Plated Shield|
|Scott Morris, Staff Packaging Engineer