Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Electromagnetic Bandgap Structures - Design, Modeling and Integration in Mixed Signal Modules|
|Keywords: Electromagnetic, Bandgap, EMI|
|Electromagnetic Bandgap (EBG) Structures are periodic structures. By integrating these structures into the power and ground planes of a package (or board) isolation levels of -100dB or higher can be achieved between any two points in the package. This allows for the miniaturization of Digital-RF modules since these ICs can be brought in close proximity to each other. By using high dielectric contant materials, the size of the EBGs can be reduced significantly. In this paper, the design of EBGs along with the modeling aspects will be discussed. Correlation between modeling and measurements will be presented. In addition, the system performance for two applications will be discussed, namely, a load board for ADC and an RF module with baseband IC.|
|Madhavan Swaminathan, Professor
Georgia Institute of Technology