Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D MID-based Packaging Devices Made Possible by MIPTEC (Microscopic Integrated Processing Technology)|
|Keywords: 3D-packaging, Laser-patterning, Miniaturization|
|What is MIPTEC? The MIPTEC (Microscopic Integrated Processing) Technology has been developed to further advance MID (Molded Interconnect Device) technology in the production of 3D circuit devices. Significant characteristics of creating MID with MIPTEC: (1) direct mounting of bear chips, such as IC, on MID, (2) formation of microscopic circuits at virtually any angle and geometry, and 3) formation of circuits on a variety of materials, including ceramics and resins. To enable the above characteristics to be realized, the following techniques were developed: (1) excellent circuit adhesion technology (chemical bonding of metals and resins), (2) microscopic 3D laser patterning technology, (3) highly reliable bonding technology (chip on MID), and (4) dicing technology. Advantages of MIPTEC Technology: By combining microscopic and complex circuits with mechanical components, MIPTEC can contribute to (1) smaller, space-saving and lighter products, (2) a fewer number of components, and (3) a fewer number of assembly processes. In addition, this proprietary processing method is suitable for wire-bonding and flip-chip bonding. Use of laser also makes it possible to produce microscopic circuits and easy to change the circuit pattern. MIPTEC examples: (1) Ultra-compact human detection sensor NaPiOn (2) Substrates for ultra-small cellular phone cameras (3) Optical converter modules for automotive LAN systems (4) Power LED lighting modules.|
|Masahiro Sato, MIPTEC Design Engineer, Connector Division
Matsushita Electrics Works
Tsu, Mie 514-855,