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Organic Residues and Plasma Treatment for Wirebond-able Gold
Keywords: Gold Wirebonding, Electroplated Gold, Plasma Treatment
Wirebonding to electroplated soft gold remains an efficient, facile, and yet elegant solution to high density interconnection on organic PCB substrates. On such gold surfaces, the ubiquitous deposition of organic processing residues, even at levels of several molecular layers, inhibits the production of reliable wirebonds. Thus, processing steps must be adopted that reduce and remove such remnants. In this paper an experiment is presented in which a matrix of solder mask deposition conditions and pre-wirebond plasma treatments were applied to electroplated gold in order to produce the most optimal wirebond strengths.
Vincenzo Casasanta, Senior Process Engineer
Crane Aerospace and Electronics - Interpoint
Redmond, WA

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