Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Vapor Phase Reflow for Reliable Assembly of a New High Performance Interconnect Technology
Keywords: SMT Connectors, Amphenol Ventura, Vapor Phase Reflow
As the electronic industry changes and the speed of computers/servers keep increasing, the need for higher signal integrity with less noise and consolidation of printed circuit space has become fundamental. As a result of this demand, components are changing from pin through hole/pin in hole technologies to surface mount technologies. One of the most complicated and higher mass SMT Connectors to be introduced into the industry is the Ventura Connector from Amphenol. The Ventura connector is a modular wafer/chicklet system interconnected by metal organizers in which each wafer can contain up to 42 SMT leads per wafer. The Ventura Connector System has the performance capability to provide signal speeds up to data rates of 6.25 Gb/s per signal for single ended designs and date rates to 12 Gb/s for Differential designs. Due to the higher thermal mass associated with this connector technology, there exists significant temperature gradients that make standard IR/Convection reflow a non-successful soldering method which causes excessive, damaging heating of neighbor components and laminates. This scenario has driven the need for a Vapor Phase Reflow to be reintroduced into the industry. Vapor Phase Reflow has a processing advantage in that its thermal blanket posseses a much greater heat density than convection or IR heating, and therefore reduces the temperature gradients across the board assembly, and prevents sensitive components from going above maximum temperature limitations. The objective of this publication is to provide an introduction into the Ventura Connector System, how it is assembled to computer cards, and how it is reworked. In addition, an introduction to Vapor Phase Reflow will be discussed, along with a study showing the requirements for a vapor phase reflow process for terminating Ventura connectors through the study of solder joint quality and various thermal profiles.
Theron Lewis, Staff Engineer
IBM Corporation
Rochester, MN


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems