Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Bond Test Methodologies for Large Aluminum Ribbon
Keywords: Aluminum, Ribbon, Testing
In any interconnect technology, there is a desire on the part of quality control, reliability engineers, and equipment operators to have test methods for determining if their interconnection has a consistent quality and is indicative of long-term reliability. Historically, the semiconductor and automotive industries have tested round aluminum wire bonds using a combination of four post-bond test methods during process qualification and process monitoring in production shear, pull, peel, and visual inspection. With the introduction of large aluminum ribbon bonding as a new interconnect technology, there is a rapidly growing interest in identifying suitable bond test methodologies and understanding how current wire bond test methods may or may not apply to this technology. Although many aspects of these test methods can be directly applied to testing ribbon bonds, there are some important considerations with ribbon bonding that will deviate from these standard practices. Orthodyne Electronics Corporation, as the leading supplier of large aluminum ribbon bonding equipment, has developed internal test standards for ribbon bonds based upon test methods used for evaluation of wire bonds. This paper overviews the visual inspection and destructive test methods used by Orthodyne for their evaluation of large aluminum ribbon bonds. Necessary test equipment and material handling capabilities will be discussed in the context of the methods proposed by Orthodyne. The need for specialized fixtures to adequately test ribbons of varying dimensions will also be addressed.
Garrett Wong, Senior Applications Engineer
Orthodyne Electronics Corporation
Irvine, CA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems