Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Technology Advancements for Flipchip Microprocessor Lid Adhesive|
|Keywords: Flipchip, Heatspreader, Adhesive|
|Market drivers for advanced microprocessor applications such as laptop and desktop computers as well as servers are demanding better power management and continued cost improvements. Contributing to the achievement of those market requirements while maintaining package reliability in the face of increasing chip power density, presents a great challenge for today’s packaging engineer. Area array flip chip packages have become the package of choice for many high speed microprocessor and ASIC devices. These flip chip packages have high density, short interconnect traces, minimal inductance with high I/O, and can operate at higher frequencies than typical die face up devices. The flipchip lid (a.k.a. heatspreader) and its attachment to the substrate are keys to the successful package. In particular, a low-stress adhesive for the lid-to-substrate bond has been shown to play a key role in managing the thermal-induced mechanical stresses between lid, chip and substrate. This paper discusses the package reliability, adhesive material properties and lid assembly process improvements resulting from the development of an optimized silicone lid adhesive. It was determined that it is possible to achieve highly durable yet compliant bonds to both the plated lid finish and package substrate while simultaneously improving assembly throughput. This required an integrated approach to adhesive material design which considered both the allowable assembly process flows as well as the performance requirements of the bonding layer to maintain package reliability.|
|Stanton J. Dent, Engineer
Dow Corning Corporation