Micross

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Examination of Thermal Via Design within LTCC Structures
Keywords: LTCC, Thermal Via, Thermal Managment
Continued effort to miniaturize microwave circuitry, especially front-end modules, has created the need for improved thermal management to effectively address the increased power density that results from decreased spacing between heat generating components. Although LTCC has a lower thermal resistance than PCB substrates, it is still desirable to lower the resistance further by introducing thermal via arrays. Thermal via design within LTCC structures, following public domain guidelines, is investigated in this paper. A thermal imaging system using an infrared camera was used to measure the top surface temperature over a range of powers and design variables. Design variables include via size and spacing, mounting pad size and LTCC thickness. The study includes calculating an equivalent thermal resistance empirically and comparing these results to theoretical equations and finite element analysis.
Tracey S. Vincent, RF Design Engineer
Barry Industries
Attleboro, MA
USA


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