Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Brightness Matrix LED Assembly Challenges and Solutions|
|Keywords: LED Matrix, Eutectic Attach, Wire Bond|
|Solid State Lighting is pervasive and will continue to grow in popularity as performance and costs mature. Products include camera phone flashes, televisions, display backlighting, automotive lighting, architectural lighting, and others still in development. Reaching performance and cost targets will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt. Several of the new products use a matrix of LED devices packaged together. These matrix LED packages present challenges for both die attach and wire bonding compared to single die packages. A brief overview of market applications and the package options is presented. A case study is presented to highlight the challenges and solutions when producing matrix LED packages. Pulse heat eutectic die attach and wire chain bonding are explored for application to matrix LED assembly.|
|Daniel D. Evans, Jr., Senior Scientist