Here is the abstract you requested from the IMAPS_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Survey of Organic Materials for Printed Circuit Board Based Cavity Packaging|
|Keywords: liquid crystal polymer (LCP), printed circuit board (PCB), RF electronics packaging|
|Liquid crystal polymer (LCP) printed circuit board (PCB) based packaging has been presented as a high performance, high value packaging approach for high frequency electronic, opto-electronic and micro-system applications. Previously we have shown LCP PCB packaging test vehicles to prevent moisture ingress into cavity packages exposed to 1,000 hours of 85oC / 85% relative humidity. These results demonstrated “functional heremticity” in LCP PCB packages with appropriate design. We have measured moisture ingress material properties of LCP and other typical organic packaging materials with various finishes. We then modeled and measured their moisture ingress performance in various PCB style cavity packages. We also measured the outgasing behavior of this set of materials. In this paper we present the results of this comparison and the resulting implications for design choices for cavity packages using organic materials.|
|Linas Jauniskis, Senior Engineer