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3D Micro Contact Package Development and Qualification Testing
Keywords: MicroContact, Package-on-Package, Qualification Testing
To address the need for more functionality without increasing their products size, a number of companies have adapted various forms of multiple-die 3D packaging. A majority of these early multiple function devices relied on the sequential stacking of die elements onto a single substrate interpose using a conventional wire-bond process. Because the wire-bonding of multiple tiers of uncased die is rather specialized and the die used may have had relatively poor wafer level yields, overall manufacturing yield of the stacked-die packaged devices have not always met acceptable levels. The information presented in this paper will focus on the stringent qualification requirements for a very thin vertically configured MicroContact package technology developed for high volume memory products. A key advantage of this package-on-package configuration is that each layer of the package can be pre-tested before joining. This capability greatly improves the overall manufacturing yield and functionality of the final package assembly is assured. The material developed for this program will also outline current expectations for multiple function packaging for hand-held and portable electronic applications and detail a number of mixed memory and mixed function variations using the vertically stacked MicroContact package technology. The motivation for developing higher density IC packaging continues to be the portable phone market and the consumers’ expectation that each new generation of products furnish greater functionality. These miniature IC package innovations have proved ideal for a growing number of portable and hand-held electronic applications. The challenge electronic manufactures face when competing in the world marketplace is to offer a product that will meet all physical and performance expectations without increasing product size or cost.
Vern Solberg, Consulting Engineer
Madison, WI

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