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Low Bounce Noise Multilayer PCB with High Performance 3D-EBG Structure
Keywords: 3D-EBG, signal integrity, Bounce Noise
With fast increase of the clock speed in the high speed digital circuits, it is very important to mitigate the bounce noise propagation on the GHz band which causes the signal integrity (SI) degradation and EMI problems. In order to construct the low power impedance up to GHz band on the thick multilayer PCB, it is required the periodic electromagnetic structure on the power plane to complement the ineffective frequencies not to be covered by the decoupling capacitors. Recently, the two dimensional electromagnetic band gap (2D-EBG) structure on the power plane is presented to eliminate the bounce noise on the power and ground plane up to a GHz band. This paper introduces a novel high performance power plane designed by employing the new EBG structure with the wide-band filtering and high attenuation on the power plane in order to minimize the electromagnetic propagation. This power plane with the three dimensional EBG structure (3D-EBG) includes the stop-band filters with periodic patterns etched in the ground plane to construct a high impedance surface geometry. It is easily obtained the higher attenuation and wider stopband in the high frequencies. Therefore, the low impedance can be obtained within the wide bandwidth through the decoupling capacitors and periodic 3D-EBG structure in the multilayer PCB applications, such as the high speed memory and LSI test. The self and transfer impedance should be obtained as low as possible for low EMI and good SI. The S-parameters are measured to confirm the stopband frequency and attenuation with an Agilent 8753ES vector network analyzer up to 6 GHz. The transfer characteristics of this test board shows the elimination with maximally 60 dB suppression from 300 MHz to 3.2 GHz and the self power impedance is measured in detail to estimate the decoupling capacitors and 3D-EBG structure. Ki-Jae Song received the Ph.D degree in radio science engineering from Kwangwoon University in 2005.Since joining Samsung Electronics in 2005, his reseach interests the development and application of the signal integrity for the digital circuits, especially high speed memory devices.
Ki-Jae Song, Multilayer PCB Designer
Samsung Electronics
Asan, Chungcheongnam-Do 336-851,
South Korea

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